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Section 14. Technology Trends

The success and proliferation of the integrated circuit since its discovery in the late 1950s has been due to the ability of manufacturers to continue offering more for the money. This ability to reduce the cost of ICs per performance has been driven by the continuous and rapid development of new and improved process technologies. Section 14 covers a variety of process technology related trends, such as the advanced lithography methods needed to continue shrinking chip geometries, new interconnect schemes, strain engineering for improved performance and lower power consumption, 3D integration, novel transistor structures, and the migration to larger wafers.