IC Insights - Global Wafer Capacity Analysis and Forecast

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Global Wafer Capacity Title

Current Edition: 2009
Brochure

Table of Contents

Report Contents

The Global Wafer Capacity Analysis and Forecast 2009 offers a detailed breakdown of the IC industry's wafer fab capacity as it stood at the mid-point of 2009 followed by a forecast for each of the next five years. The data were compiled, summarized, and extended into the future using both bottom-up and top-down research methodologies. Surveys of hundreds of fabs from around the world formed the basis for analyzing the industry's current capacity status. Future projections were based on both survey results and IC Insights' overall economic forecast for the IC industry.

The capacity analysis and forecast is presented in more than 50 charts and tables. In addition, a 23-page addendum is provided showing detailed specifications, such as wafer size, capacity, and minimum process geometry, for all the fabs considered for the study.

Samples of the More Than 50 Charts and Tables

• 113 IC Manufacturers Included in the Data Compilation

• Capacity, Wafer Start, and Utilization Tren

• Worldwide Installed Capacity Trend)

• Worldwide Installed Capacity Yr/Yr Changes in Volume

• Installed Wafer Capacity Leaders as of Mid-2009

• Capacity Leaders' Shares of Total WW Capacity

• Capacity Leaders per Geographic Region

• Existing WW Installed Capacity by Geographic Region

• Regional Installed Capacity by Wafer Size

• Installed Capacity for Each Wafer Size by Region

• Installed Capacity by Region Forecast

• Existing WW Installed Capacity by Wafer Size

• Capacity Leaders per Wafer Size

• 300mm Wafer Fabs

• 300mm Wafer Starts and Fab Count

• Number of Companies with 200mm vs. 300mm Fabs

• Potential 450mm Wafer Players

• Installed Capacity by Wafer Size Forecast

• Existing WW Installed Capacity by Process Technology

• Regional Installed Capacity by Process Technology

• Existing WW Installed Capacity by Minimum Geometry

• Regional Installed Capacity by Minimum Geometry

• Installed Capacity Leaders per Minimum Geometry

• Installed Capacity by Geometry Forecas

• SICAS' Historical Wafer Capacity by Dimensions

• Existing WW Installed Capacity by Product Type

• IC Devices Contained Within Each Product Category

• Foundry Capacity by IC Device Type

• Regional Installed Capacity by Product Type

• Installed Capacity by Product Forecas

• Capital Spending as a Percent of Sales

• Capital Spending Down Despite High Capacity Utilization

• The Upcoming Collision Course

Detailed Fab Specifications Provided

For each of the more than 445 fab facilities surveyed for this study, detailed specifications are provided in an addendum. The specifications include:

Company Name
Fab Name
Fab Location (city, state, province, prefecture, county, etc).
Date Opened
Wafer Size (mm)
Wafer Capacity (wafers/month) as of Jul-2009 and Planned Maximum Capacity
Process(es) Ran
Minimum Geometry of Processes
Product(s) Fabricated