Current Edition: 2009
Table of Contents
The Global Wafer Capacity Analysis and Forecast 2009 offers a detailed breakdown of the IC industry’s wafer fab capacity as it stood at the mid-point of 2009 followed by a forecast for each of the next five years. The data were compiled, summarized, and extended into the future using both bottom-up and top-down research methodologies. Surveys of hundreds of fabs from around the world formed the basis for analyzing the industry’s current capacity status. Future projections were based on both survey results and IC Insights’ overall economic forecast for the IC industry.
The capacity analysis and forecast is presented in more than 50 charts and tables. In addition, a 23-page addendum is provided showing detailed specifications, such as wafer size, capacity, and minimum process geometry, for all the fabs considered for the study.
Samples of the More Than 50 Charts and Tables
Detailed Fab Specifications Provided
For each of the more than 445 fab facilities surveyed for this study, detailed specifications are provided in an addendum. The specifications include: